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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180 from wholesalers
     
    Buy cheap PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180 from wholesalers
    • Buy cheap PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180 from wholesalers

    PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEF
    Certification : CE,FCC,Rohs,ISO9001,SGS,UL
    Price : USD 1-500
    Payment Terms : Western Union, L/C, T/T
    Supply Ability : 10000000pcs / per month
    • Product Details
    • Company Profile

    PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180

    PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180 ​


    Specification:


    Base Material: FR4
    Layer:6
    Thickness: 1.0MM
    Copper weight:1OZ
    Surface finish: HASL

    Features:


    Base Material: Aluminum/FR4/CEM1/CEM3

    Layer: 1 layer/2 layers

    Board Thickness: 0.3-3mm

    Min.Board Dimension: 4x4mm

    Max.Board Dimension: 1500x600mm

    Copper layer: 1oz/2oz/3oz

    Solder Mask: White/Black/Blue/Red

    Silkscreen: Black/White

    Surface finish: LF HAL/HAL/OSP/Gold immersion/Silver plating

    Outline Profile: CNC routing/V-Cut/Punching

    All of the parameters can be customized!


    Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

    With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.


    Parameter:


    Layer No.1-16
    Min board thickness2 layer 0.2mm
    4 layer 0.4mm
    6 layer 0.6mm
    8 layer 0.8mm
    10 layer 1.0mm
    Max panel size508*610mm
    Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness  >0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm



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