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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers
     
    Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers
    • Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers
    • Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers

    High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE Bh700
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

    High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin


    Quick Detail :
    1. Type : Pcb
    2. Material : Rogers
    3. Layer : Multilayer
    4. Products Size :11*9cm
    5. Permittivity : 2.5
    6. Surface finish : Immersion Tin

    Features:


    FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :

    1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

    2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

    3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger



    Data :

    Layer1 to 28 layers
    Material typeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    Board thickness0.21mm to 7.0mm
    Copper thickness0.5 OZ to 7.0 OZ
    Copper thickness in hole>25.0 um (>1mil)

    Size

    Max. Board Size: 23 × 25 (580mm×900mm)
    Min. Drilled Hole Size: 3mil (0.075mm)
    Min. Line Width: 3mil (0.075mm)
    Min. Line Spacing: 3mil (0.075mm)

    Surface finishing

    HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

    Tolerance


    Shape tolerance: ±0.13
    Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    CertificateUL, ISO 9001, ISO 14001
    Special requirementsBuried and blind vias+controlled impedance +BGA
    ProfilingPunching, Routing, V-CUT, Beveling

    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


    Benefits:

    • High Glass Transition Temperature (Tg) (150Tg or 170Tg)

    • High Decomposition Temperature (Td) (> 325º C)

    • Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)

    • Dielectric Constant (@1 GHz): 4.25-4.55

    • Dissipation Factor (@ 1 GHz): 0.016

    • UL rated (94V-0, CTI = 4)

    • Compatible with standard and lead-free assembly.

    • Laminate thickness available from 0.005” to 0.125”

    • Pre-preg thicknesses available (approximate after lamination):

    (1080 glass style) 0.0022”

    (2116 glass style) 0.0042”

    (7628 glass style) 0.0075”


    Typical Applications:

    • Phase Array Antennas
    • High Reliability Complex Multilayer Circuits
    • Ground Based and Airborne Radar Systems
    • Commercial Airline Collision Avoidance Systems
    • Global Positioning System Antennas
    • Beam Forming Networks

    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.












    Quality High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin for sale
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