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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCER |
| Certification : | CE,ROHS, FCC,ISO9008 |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
FM AM Radio RF PCB For Mobile 3G / 4G Base Station With High Frequency Rogers Material
Quick detail:
Layer of number | 4 | Surface finish | enig |
Base material | Rogers | Cu THK | 1OZ |
Board THK | 1.6mm | File format | Gerber/CAD |
Board size | 8*5cm | Solder mask | Green/blue/black/red |
Advantage:
1 laser drill hole machine
2 Using best bonding material raw
3 main in high frequency pcb
4 FR4+ROGERS mixed compression is available.
Description:
Shenzhen Xinchenger Electronics is a leading manufacturer of high frequency pcb circuit more than 6
years in shenzhen.
We concentrate on high difficult,high precision pcb circuit board production.3mil line space and width is
available here
If you have any needs,please do not hesitate to send us inquiry.
Application:
Industrial automation controls,Wireless and wired telecommunication
Medical instrumentation,Transportation and so on.
Specification:
Annual stock meterial | Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free | ||
Layer No. | 1-16 | ||
Min board thickness | 2 layer 0.2mm | ||
4 layer 0.4mm | |||
6 layer 0.6mm | |||
8 layer 0.8mm | |||
10 layer 1.0mm | |||
Max panel size | 508*610mm | ||
Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||
Wall hole copper thickness | ＞0.025mm(1mil) | ||
Finished hole | 0.2mm-6.3mm | ||
Min line width | 4mil/4mil(0.1/0.1mm) | ||
Min bonding pad space | 0.1mm(4mil) | ||
PTH aperture tolerance | ±0.075mm(3mil) | ||
NPTH aperture tolerance | ±0.05mm(2mil) | ||
Hole site deviation | ±0.05mm(2mil) | ||
Profile tolerance | ±0.10mm(4mil) | ||
Board bend&warp | ≤0.7% | ||
Insulation resistance | ＞1012Ωnormal | ||
Through-hole resistance | ＜300Ωnormal | ||
Electric strength | ＞1.3kv/mm | ||
Current breakdown | 10A | ||
Peel strength | 1.4N/mm | ||
Soldmask regidity | ＞6H | ||
Thermal stress | 288℃20Sec | ||
Testing voltage | 50-300v | ||
Min buried blind via | 0.2mm(8mil) | ||
Outer cooper thickness | 1oz-5oz | ||
Inner cooper thickness | 1/2 oz-4oz | ||
Aspect ratio | 8:1 | ||
SMT min green oil width | 0.08mm | ||
Min green oil open window | 0.05mm | ||
Insulation layer thickness | 0.075mm-5mm | ||
Aperture | 0.2mm-0.6mm | ||
Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||
Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver, ENIG,Blue glue,gold plating | ||
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