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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCEPCB |
| Model Number : | XCEPCBR |
| Certification : | CE,FCC,ISO9008,SGS,UL |
| Price : | USD 0.1-10 |
| Payment Terms : | Western Union,, T/T |
| Supply Ability : | 1000000PCS/per week |
| Delivery Time : | 3-12 days |
6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave
Capability | Standard | Advanced |
Minimum Layer Count | 1 | 1 |
Maximum Layer Count | 12 | 40 |
Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core | |
Board Thickness | 0.020"-0.125" | 0.005"-0.250" |
Maximum Board Size | 16" x 22" 12" x 21" 22" x 28" | 10" x 16" 16" x 22" 12" x 21" 22" x 28" |
Copper Thickness | 0.5 oz – 3 oz | 0.25 oz – 12 oz |
Minimum Trace Width / Spacing | 0.004"/0.004" | 0.003"/0.003" |
Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
Minimum Hole Size | 0.008" | 0.004" |
Finished Hole Size Tolerance | +/-0.003" | +/-0.002" |
PCB Surface Finish | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG, HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold | |
IPC Class | Class 2 | Class 3 |
Controlled Impedance Tolerance | +/-10 % | +/-5 % |
Blind Vias | Yes | Yes |
Buried Vias | Yes | Yes |
Aspect Ratio | 8/1 | 15/1 |
Minimum Core Thickness | 0.004" | 0.002" |
Carbon Ink | Yes | Yes |
Peelable Mask | Yes | Yes |
Solder Sample | Yes | Yes |
First Article | Yes | Yes |
ISO 9001: 2008 | Yes | Yes |
ISO/TS16949: 2009 | Yes | Yes |
UL 94v0 | Yes | |
Specification:
Files:Gerber,protel,powerpcb,Autocad,etc.
Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum
Layer count:1-24 layers
Max.Panel Size:450*1500mm
Board Thickness:0.2-5mm
Min. Core Thickness:0.075mm
Cu Thickness:12-140um
Min. Drill Size:0.2mm
Max. Aspect Ratio: 8:1
Min. Trace Width: 0.1mm
Min line spacing:0.075mm
Min. SMT/QFP Pitch:0.4mm
v Fast PCB Fabrication for Samples and Mass Production
v Electronic Components Sourcing Services
v PCBA Assembly Services:SMT,DIP,BGA...
v Function Test
v Stencil,Cable and Enclosure Assembly
v Reverse engineering service
v Standard Packing and On time Delivery
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