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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCET |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
High Signal Transmission Taconic High Frequency PCB Circuit Boards
Technology Sheet
| Capabilities | Standard Production | Advanced Production |
| Layer Count / Technology | 4 - 28 Layers | 4 - 28 Layers |
| PCB Thickness Range | 0.5 - 2.4 mm | 0.32 - 2.4 mm |
| Build Up | Core & Hybrid Build Up | Core & Hybrid Build Up |
| Materials | FR4 / Rogers / Taconic / others (Teflon based) | FR4 / Taconic / Rogers / others on request |
| Glass Transition Temperature | 105℃ / 140℃/ 170℃ | 105℃/ 140℃/ 170℃ |
| Standard Glass Cloth | 106 / 1080 / 2116 / 1501 / 7628 | 1037 / 106 / 1080 / 2116 / 1501 / 7628 |
| Copper Thickness | 18μm / 35μm / 70μm | 9μm / 18μm / 35μm / 70μm |
| Copper Plating Holes | 20μm (25μm) | 13μm / 20μm/ 25μm |
| Min. Line / Spacing | 100μm / 100μm | 50μm / 50μm |
| Soldermask Registration | ‘+/- 65μm(Photoimageable) | ’+/- 25μm (Photoimageable) |
| Min. Soldermask Dam | 75μm | 60μm |
| Soldermask Color | Green / white / black / red / blue | Green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609.6 mm x 530 mm | 609.6 mm x 530 mm |
| 609.6 mm x 457.2 mm | 609.6 mm x 457.2 mm | |
| Min. Annular Ring | 150μm | 100μm |
| Smallest Drill | 0.28 mm | 0.15 mm |
| Smallest Routing Bit | 0.8 mm | 0.8 mm |
| Surfaces | OSP / HAL Lead Free / Immersion Tin | OSP / HAL Lead Free / Immersion Tin |
| Immersion Ni/Au | Immersion Ni/Au | |
| Plated Ni/Au | Plated Ni/Au | |
| Immersion Ag | Immersion Ag | |
| Scoring | Yes | Yes |
| ID Print | White | White |
| Blue Mask & Carbon Print | Yes | Yes |
Introduction:
The increasing complexity of electronic components and switches continually requires faster
signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times
in electronic components, it has also become necessary for high frequency (HF) technology to
view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that the
impedance (dynamic resistance) varies with respect to the sending component. To prevent such
capacitive effects, all parameters must be exactly specified, and implemented with the highest level
of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace
geometry,the layer buildup, and the dielectric constant (er) of the materials used.
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