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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB from wholesalers
     
    Buy cheap Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB from wholesalers
    • Buy cheap Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB from wholesalers
    • Buy cheap Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB from wholesalers

    Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCER-1
    Certification : CE,ROHS, FCC,ISO9008
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

    Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application


    Specification


    • 2 layer
    • Green solder mask,
    • white silk screen
    • Model:XCER
    • Size: 15*9cm
    • Location: Shenzhen
    • Board thickness: 0.2mm
    • Copper thickness: 1OZ

    Laminates:


    • High Tg, BT resins
    • Low Dk, Low Df Formulations
    • High Strength, Low CTE selections
    • Polyimide/Kapton
    • Multi-function FR-4
    • Min Cladding 1 oz
    • Max Cladding 2 oz
    • Min Thickness .03mm (.0012)

    Parameter


    Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness  >0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Special technologyInpedance,blind buried via,thick gold,aluminumPCB
    Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


    Advantage:


    Newest PCB machine and top technology,professional engineer team

    Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.

    Accept utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.

    Utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.


    Quality Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB for sale
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