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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing from wholesalers
     
    Buy cheap Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing from wholesalers
    • Buy cheap Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing from wholesalers
    • Buy cheap Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing from wholesalers

    Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing

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    Brand Name : XCE
    Model Number : XCER
    Certification : CE,ROHS, FCC,ISO9008,SGS
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    Radar Detector Module Rogers PCB Custom Multilayer Printed Circuit Board Manufacturing

    Radar Detector Module Using Rogers PCB Board With Multilayer Circuit


    Specification


    Size: 3*3cmOrigin: Shenzhen,China
    Model: XCERNumber of layer: 2
    Solder mask: greenSilk screen: white
    Surface finish: ENIGCu thickness: 2OZ
    Min line space: 5milMil line width: 5mil

    Description:


    Xinchenger has radar sensor PCB experience in specific applications. Typical applications include distance or speed measurement and target detection. XCE are also able to offer the first level of signal processing/conditioning. This can be in either the analogue or digital domain. Microprocessor control is also used to control the radar function, this enables additional functionality to be included.


    Parameter


    Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness  >0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Special technologyInpedance,blind buried via,thick gold,aluminumPCB
    Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


    Service:


    1. pcb design and pcb layout;

    2.pcb manufacturing;
    3. electronic components procurement;
    4. pcb assembly & pcba manufacturing;
    5. functional testing.


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