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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process from wholesalers
     
    Buy cheap High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process from wholesalers
    • Buy cheap High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process from wholesalers
    • Buy cheap High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process from wholesalers

    High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCER
    Certification : CE,ROHS, FCC,ISO9008,SGS
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process

    High Frequency Impedance Rogers PCB Control 6 Layer Circuit Board


    Specification


    PCB Type:

    Rogers PCB

    Layer :

    6 layer

    Min .Line Width/Space:

    3mil/3mil

    Min. Via Diameter:

    0.3mm

    Finish Thickness:

    0.2mm

    Surface Finish:

    ENIG

    Size:

    16*14CM

    Material:

    4350B

    Color:

    golden

    Application:

    high technology



    Description:


    A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.

    Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.


    Parameter


    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300v
    Min buried blind via0.2mm(8mil)
    Outer cooper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickness0.075mm-5mm
    Aperture0.2mm-0.6mm
    Special technologyInpedance,blind buried via,thick gold,aluminumPCB
    Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

    Quality High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process for sale
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