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Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process from wholesalers
     
    Buy cheap Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process from wholesalers
    • Buy cheap Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process from wholesalers
    • Buy cheap Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process from wholesalers

    Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

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    Brand Name : XCE
    Model Number : XCER-1
    Certification : CE,ROHS, FCC,ISO9008
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

    Rogers PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment


    Specification:


    Brand: XCE
    Number of layer: 2
    Surface finish: Gold plating
    Board size: 10*20cm
    Board thickness: 0.2mm
    Cu thickness: 1OZ
    Base material: Rogers4350B
    Origin: Shenzhen

    Knowledge:


    What's difference between immersion gold and gold plating?

    Gold plating: Hard gold, electronic gold

    Immersion gold: Soft gold, ENIG

    Gold plating: using the way of electroless plating, the gold particles are attached to the pcb board, because strong adhesion, also known as hard gold, memory of the finger as hard gold, generally bound pcb also using gold plating.
    Immersion gold: through a chemical reaction, crystallization gold particles attached to the pcb pad, because of weak adhesion, also known as soft gold


    Parameter


    Board thickness tolerance

    T≥0.8mm±8%,T<0.8mm±5%

    Wall hole copper thickness

    >0.025mm(1mil)

    Finished hole

    0.2mm-6.3mm

    Min line width

    4mil/4mil(0.1/0.1mm)

    Min bonding pad space

    10mil

    PTH aperture tolerance

    10mil

    NPTH aperture tolerance

    10mil

    Hole site deviation

    10mil

    Profile tolerance

    ±0.10mm

    Board bend&warp

    ≤0.7%

    Insulation resistance

    >1012Ωnormal

    Through-hole resistance

    <300Ωnormal

    Electric strength

    >1.3kv/mm

    Current breakdown

    10A

    Peel strength

    1.4N/mm

    Soldmask regidity

    >6H

    Thermal stress

    288℃20Sec

    Testing voltage

    50-300v

    Min buried blind via

    N/O

    Outer cooper thickness

    3oz

    Inner cooper thickness

    3oz

    Aspect ratio

    8:1

    SMT min green oil width

    0.08mm

    Min green oil open window

    0.05mm

    Insulation layer thickness

    0.075mm-5mm

    Aperture

    0.2mm-0.6mm


    Advantage:


    Sufficient rogers material raw,promopt response and delivery time.

    24 hours online quotation service



    Quality Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process for sale
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