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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEF |
| Certification : | CE,ROHS, FCC,ISO9008,SGS |
| Price : | negotiation |
| Payment Terms : | T/T,Western union, L/C, MoneyGram |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
DK = 3.38 Rogers 4003C RF / Microwave PCB Circuit Boards Maker
Technology:
Material | FR4(standard) | Isola |
FR4(Hi-Tg) | Isola / Nanya / ITEQ | |
Rogers | RO4003 /4350 /3010 /RT Duroid 5880 / 5870 | |
Arlon | Diclad 25N / 25FR / 870 / 880 | |
Taconic | TLY / TLC / RF35 / RF30 | |
GETEK | RG200D / ML200D | |
Aluminum PCBs | Di-electric materials : FR4 / Bergquist / Rogers / Thermagon | |
Copper weight | 1 ~ 5 oz internal & external layers | |
Drilling | Min. Drilled Hole Size | 10 mil ( 6 ~ 8 mil finished) |
Annular Ring | 5 mil(normal) / 4 mil (for Laser vias) | |
Registration | ± 3 mil | |
Max. Aspect Ratio | 10 :1 | |
Hole Size Tolerance | +/- 3 mils (PTH) ; +/- 2 mils (N-PTH) | |
Hole Roughness | < 0.8 mil | |
Min. Cu Plating in Holes | > 0.8mil, Ave. 1 mil | |
Laser drill | available | |
Image Transfer | Min. Trace and space | 4 / 4 mil |
SMT / BGA.Pitch | 10 mils for SMT / 30 mils for BGA | |
Trace/space Tolerance | ± 20% (or +/- 10% per IPC class 3) | |
Solder Mask | LPI Solder Mask | Green(glossy or matte), Blue, Red, Black, Yellow |
Via Plugging | min. 80% filled | |
Solder Mask ink | Taiyo & Tamura | |
Registration | ± 2 mil | |
Min Solder Dam | 2.5 mil | |
Thickness | 0.5 ~1.5 mil | |
Silkscreen | White, Yellow, Black | |
Min. silkscreen width | 8 mil | |
CNC Dimension | ± 5 mil | |
Punch Dimension | ± 4 mil | |
Blind Vias / Buried Vias | Yes | |
VIP (Via in Pad) | Yes (Non-conductive epoxy resin-filled or Cu filled) | |
Impedance control | ± 10% | |
Surface Finish | HASL | 200 ~ 500 μ" |
Pb free HASL | 100 ~ 500 μ" | |
Immersion Gold | 1 ~ 5 μ" | |
Immersion Silver | 6 ~ 12 μ" | |
Immersion Tin | 25 ~ 40 μ" | |
Electolytic Gold | Yes | |
Gold Finger Plating | 5 ~ 40 μ" | |
OSP(Entek) | yes | |
Solder Mask Coating Method | Silkscreen printing (Double or triple coatings available) | |
Carbon Ink | 20 Ω | |
Peelable mask | Thickness = 0.3 mm | |
Pumice Pre-treatment | Available | |
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