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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness from wholesalers
     
    Buy cheap OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness from wholesalers
    • Buy cheap OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness from wholesalers
    • Buy cheap OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness from wholesalers

    OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCET
    Certification : CE,ROHS, FCC,ISO9008,SGS
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness

    Permittivity ER=10 Taconic PCB CER-10 Based On Military Grade Material


    Specification:


    Board size28*12cmBoard thickness1.2mm
    Layer4Base materialtaconic
    Min line space5milMin line width5mil
    BrandXCETOriginChina


    Parameter

    CER-10 is a ceramic loaded DK 10 laminate, based on a woven glass reinforcement. CER-10 is a result of Taconic’s expertise in both ceramic fill technology and in coated PTFE fabrics.
    CER-10 exhibits exceptional interlaminar bond strength and solder resistance. CER-10’s proprietary composition results in low moisture absorption and uniform electrical properties.
    CER-10’s woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. This DK 10 laminate exhibits low Z-axis expansion (CTE 46 ppm/°C), allowing for plated-through-hole reliability in extreme thermal environments.
    CER-10 laminates can be sheared, drilled, milled and plated, using standard methods for PTFE/woven fiber-glass materials.


    Application:

    • High Power Amplifier, TMA, TMB, LNA: for GSM, UMTS, 3G, PCS, PCN, WCDMA, TD-SCDMA, EDGE, CDMA2000
    • Repeater
    • Phase Shifter
    • Antenna
    • Filters and Coupler
    • Passive Components

    Advantage:

    • Exceptional Interlaminar Bond
    • Low Moisture Absorption
    • Enhanced Dimensional Stability
    • Low Z-Axis Expansion
    • Stable Dk Over Frequency
    • Circuit Miniturization
    • Increased Flexural Strength

    Taconic Model THK ER

    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    Quality OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness for sale
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