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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service from wholesalers
     
    Buy cheap Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service from wholesalers
    • Buy cheap Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service from wholesalers
    • Buy cheap Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service from wholesalers

    Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEF
    Certification : CE,ROHS, FCC,ISO9008
    Price : negotiation
    Payment Terms : T/T,Western union, L/C, MoneyGram
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    Turnkey Solar Inverter FR4 Multi Layer PCB Circuit Board With Design and Prototype Service


    Turnkey Solar Inverter FR4 PCB Circuit Board With Design Service

    Specification:


    Layers:2Material:FR4
    Board thickness:1.2MMCopper thickness:1.5OZ
    Min hole size:8milMin line space:8mil
    Min line width:8milSurface:Lead free
    Solder mask color: greenCertificate:Iso9001,SGS

    Parameter:


    Copper thickness in hole

    >25.0 um (>1mil)


    Size

    Max. Board Size: 23 × 25 (580mm×900mm)

    Min. Drilled Hole Size: 3mil (0.075mm)

    Min. Line Width: 3mil (0.075mm)

    Min. Line Spacing: 3mil (0.075mm)


    Surface finishing

    HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating


    Tolerance


    Shape tolerance: ±0.13

    Hole tolerance: PTH: ±0.076 NPTH: ±0.05

    Certificate

    UL, ISO 9001, ISO 14001

    Special requirements

    Buried and blind vias+controlled impedance +BGA

    Profiling

    Punching, Routing, V-CUT, Beveling

    Any other special material please feel free to let us know

    Application:
    telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.


    Description:


    Standard products(4, 6 layers), FR4, photo-sensitive soldermask

    Special types (thick copper, thin core, hard gold, etc)

    High layer count(8-40 layers)

    High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…

    Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4

    Back panels: thick PCBs, press-fit technology, large size PCBs.





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