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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB from wholesalers
     
    Buy cheap Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB from wholesalers
    • Buy cheap Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB from wholesalers
    • Buy cheap Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB from wholesalers

    Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB

    Printed Circuit Board Multilayer PCB FR4 Material Custom-Made Service


    Specification:


    Model: XCEM

    Origin: China

    Min line space: 10mil

    Min line width: 10 mil
    Board size: 16*6 cm

    Layer: 8

    Board thickness: 1.2mm

    Copper foil: 35UM

    Material: FR4


    Our Quality:


    We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:

    High-voltage E-test
    Flying probe machine
    Digital computer metallographic microscope
    Copper thickness tester
    Solderability detecting machine
    Photoelectricity balance
    X-ray gold thickness tester
    Backlighting tester
    Automatic optical inspector


    Parameter:


    Technology

    Capabilities

    Capabilities

    Max.Layer Count

    30 Layers

    30 Layers

    Max.Panel Size

    27.5"x24"

    27.5"x24"

    Max.Board Thickness

    3.5mm

    5.8mm

    Outer Layer

    3.5/3.5mils

    3/3mils

    Inner Layer

    3.5/3.5mils

    3/3mils

    Min.Board Thickness

    2L:6mils

    2L:6mils


    4L:15mils

    4L:15mils


    6L:23mils

    6L:23mils

    Min.SMT/BGA Pitch

    12mils for SMT

    12mils for SMT


    24mils for BGA

    20mils for BGA

    Min.Drill Size&Aspect Ratio

    0.2mm Drill for 0.8mm Thickness(4.0:1)

    0.2mm Drill for 0.8mm
    Thickness(4.0:1)


    0.25mm Drill for 1.6mm
    Thickness(6.4:1)

    0.25mm Drill for 1.6mm
    Thickness(6.4:1)


    0.30mm Drill for 2.4mm
    Thickness(8.0:1)

    0.30mm Drill for 2.4mm
    Thickness(8.0:1)

    Surface Finishes

    HASL

    HASL


    Selective Immersion Tin

    Selective Immersion Tin


    Immersion Silver

    Immersion Silver


    Immersion Gold

    Immersion Gold


    Hard Gold

    Hard Gold


    OSP

    OSP


    Gold finger

    Gold finger

    Controlled Impedance

    +/- 10%

    +/-7%

    Contouring

    Routing, V-Groove,

    Routing, V-Groove,


    Beveling Punch

    Beveling Punch

    Hole Diameter

    +/- 2 mil

    +/- 2 mil

    Min.S/M Thickness

    0.4 mil

    0.6 mil


    Quality Custom FR4 Material Multilayer PCB Printed Circuit Board Design Service 8 Layer PCB for sale
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