Sign In | Join Free | My himfr.com
himfr.com

Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

Site Member

10 Years

Home > Multilayer PCB >

Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing

Shenzhen Xinchenger Electronic Co.,Ltd
Contact Now
    Buy cheap Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing from wholesalers
     
    Buy cheap Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing from wholesalers
    • Buy cheap Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing from wholesalers

    Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing

    Car Electronics Multilayer PCB With High Thermal Conductivity Functions


    Specification:


    ModelXCEMOriginShenzhen
    Min line space3milMin line width3mil
    Size18*9cmCopper foil70UM
    Layer6MaterialFR4

    Parameter:


    Technology

    Capabilities

    Capabilities

    Max.Layer Count

    30 Layers

    30 Layers

    Max.Panel Size

    27.5"x24"

    27.5"x24"

    Max.Board Thickness

    3.5mm

    5.8mm

    Outer Layer

    3.5/3.5mils

    3/3mils

    Inner Layer

    3.5/3.5mils

    3/3mils

    Min.Board Thickness

    2L:6mils

    2L:6mils


    4L:15mils

    4L:15mils


    6L:23mils

    6L:23mils

    Min.SMT/BGA Pitch

    12mils for SMT

    12mils for SMT


    24mils for BGA

    20mils for BGA

    Min.Drill Size&Aspect Ratio

    0.2mm Drill for 0.8mm Thickness(4.0:1)

    0.2mm Drill for 0.8mm
    Thickness(4.0:1)


    0.25mm Drill for 1.6mm
    Thickness(6.4:1)

    0.25mm Drill for 1.6mm
    Thickness(6.4:1)


    0.30mm Drill for 2.4mm
    Thickness(8.0:1)

    0.30mm Drill for 2.4mm
    Thickness(8.0:1)

    Surface Finishes

    HASL

    HASL


    Selective Immersion Tin

    Selective Immersion Tin


    Immersion Silver

    Immersion Silver


    Immersion Gold

    Immersion Gold


    Hard Gold

    Hard Gold


    OSP

    OSP


    Gold finger

    Gold finger

    Controlled Impedance

    +/- 10%

    +/-7%

    Contouring

    Routing, V-Groove,

    Routing, V-Groove,


    Beveling Punch

    Beveling Punch

    Hole Diameter

    +/- 2 mil

    +/- 2 mil

    Min.S/M Thickness

    0.4 mil

    0.6 mil


    Our Quality:


    We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:

    High-voltage E-test
    Flying probe machine
    Digital computer metallographic microscope
    Copper thickness tester
    Solderability detecting machine
    Photoelectricity balance
    X-ray gold thickness tester
    Backlighting tester
    Automatic optical inspector


    Quality Car Electronic PCB Board High Thermal Conductivity Multi Layer Printed Circuit Board Manufacturing for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Xinchenger Electronic Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)