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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service from wholesalers
     
    Buy cheap 4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service from wholesalers
    • Buy cheap 4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service from wholesalers
    • Buy cheap 4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service from wholesalers

    4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service

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    Brand Name : XCE
    Model Number : XCEH
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
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    4 Layer Quick Turn HF PCB High Speed Printed Circuit Board Manufacturing Service

    4 Layer High Frequency PCB High Speed Service Printed Circuit Board Manufacturing


    Specification:


    Brand: XCE
    Model: XCEH
    Board size: 15*15cm
    Cu thickness: 35UM
    Material: taconic
    Min line space&width: 5Mil

    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2

    Description:


    For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

    Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

    We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

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