Multilayer 4003 Rogers PCB , Immersion Gold Printed PCB Board

Specification:

Quick detail:

Rogers 4003 substrate

2 layer Rogers 4003 pcb material

Green solder mask,

white silk screen

Model:XCER-1

Size:8*6cm

Location:Shenzhen

Application:

a Telecom: transmitter. Receiver. Oscillator. Antenna.

b Satellite receiver

c Global location system, amplifier, satellite telecom

d Microwave transmission

e Automobile telephone

f Measure apparatus, LSI inspector, analyser, signal oscillator

g High frequency teletcom, high speed transmission, high security, high transmission quality, high memory transaction

Rogers pcb material in stock:

Multilayer rogers 4003C PCB DATA SHEET:

The methods employed to achieve low resistance electrical connections and good mechanical integrity fall into two categories: true fusion welding,

where the metals of the lead and the circuit pad are melted, and a form of diffusion where the joint is made without melting.

Welded Bonds: 1) Resistance Welding — The lead and circuit conductor are pressed together and a high current pulse (usually from a capacitor) passed between the two. Heat caused by the passage of the current through the resistance of the joint melts and welds the metal. 2) Parallel Gap Welding — This is a specialized form of resistance welding. In this case the electrical energy is supplied to a pair of parallel electrodes, which are in contact with the device leads. The weld depends upon conduction of heat generated in the lead to the circuit pad to melt and fuse them together 3) Percussive Arc Welding — The lead and pad are held a small distance apart and an arc is generated by applying a short pulse of RF energy to ionize the gap, followed by a discharge from the capacitor. As the arc decays, a mechanical device forces the two heated surfaces together and completes the weld. 4) Electron Beam Welding — A beam of high-speed electrons is focused in a vacuum on the lead and pad held together. The energy of the electrons is absorbed, raising the temperature to the melting point of the metals. 5) Laser Welding — Energy is focused on the work piece by an intense, collimated, monochromatic light beam that is absorbed and raises the temperature to the fusion point. 6) Soldering — The lead and pad are coated with a low melting point alloy and pressed together. Heat is applied either locally (by a heating tool) or generally (by infrared or oven heating) to melt the solder and weld the two components together.

Diffusion Bonding: 1) Ultrasonic Welding — Diffusion of metal between the lead and pad is induced by clamping the two together and applying mechanical energy in the form of ultrasonic sound vibration. The metal surfaces are cleaned by friction, which also heats them, aiding in the diffusion process, but temperatures do not reach the melting point. 2) Thermal Compression Bonding — Metal diffusion in this method is accomplished by heat and pressure applied to the cleaned surfaces of the lead and pad. The temperature is insuffi cient to give a true fusion weld. 3) Thermosonic Bonding — This method is a combination of ultrasonic and thermal compression bonding. The work is preheated, and ultrasonic energy is supplied through a gold capillary. Again, the weld is achieved at temperatures below the fusion point of the metal.

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.