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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System from wholesalers
     
    Buy cheap 4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System from wholesalers
    • Buy cheap 4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System from wholesalers
    • Buy cheap 4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System from wholesalers

    4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE BI580
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
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    4 Layer High Frequency PCB Microwave Rogers PCB Board For RFIC System

    4 Layer High Frequency Microwave Rogers PCB Used For RFIC System


    Quick Detail :

    TypePcb
    MaterialRogers
    Layer4
    Size8*7cm
    Permittivity3
    ColorGreen
    Surface FinishImmersion Gold


    Features:


    High frequency pcb with multilayer RF Microwave . It normaly used for radar antenna wireless and military feilds . Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products . Immersion gold surface finish make the pcb 's conductive performance enhancements. Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision


    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.

    Detailed Images :




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