Sign In | Join Free | My himfr.com
himfr.com

Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

Site Member

10 Years

Home > Fr4 PCB >

Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity

Shenzhen Xinchenger Electronic Co.,Ltd
Contact Now
    Buy cheap Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity from wholesalers
     
    Buy cheap Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity from wholesalers
    • Buy cheap Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity from wholesalers

    Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE BI235
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity

    Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity ​


    Quick Detail :

    TypeFr4 pcb
    MaterialFr4
    ColorGreen
    LayerMultilayer
    Size8*8cm
    Surface FinishENIG




    Features:



    High Frequency FR4 pcb with half hole buried techolonogy . It owns lowest stable permittivity ,and used widely in many feild . It is multilayer pcb by high techonology of compression machine . The special professional maker way in the top rank level . It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    Fr4CER-101.610.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :


    When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.

    In the USA, FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254 µm) to 3 inches (76 mm).

    In the USA, copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2(300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1 µm (1.34 thou), 68.2 µm (2.68 thou), and 102.3 µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 µm (may also be referred to as 35 μ, 35 micron, or 35 mic).


    High Thermal Performance

    • Tg of 200 (DSC), 230°C (DMA)

    • Low CTE for reliability

    • Lead-free Compatible & Rhos Complaint

    • UV Blocking and AOI Fluorescence

    • Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat


    Typical Applications:

    • Space Saving Circuitry
    • Patch Antennas
    • Satellite Communications Systems
    • Power Amplifiers
    • Aircraft Collision Avoidance Systems
    • Ground Radar Warning Systems
    • Datalink on cable systems
    • Remote meter readers
    • Power backplanes
    • LMDS and wireless broadband
    • Base station infrastructure

    Production Description :


    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.

    Quality Multilayer High Frequency Fr4 Pcb With Half Hole Buried Tech With Relative Permittivity for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Xinchenger Electronic Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)