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Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm

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    Buy cheap Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm from wholesalers
     
    Buy cheap Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm from wholesalers
    • Buy cheap Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm from wholesalers
    • Buy cheap Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm from wholesalers

    Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm


    Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm


    Quick detail:

    Origin:ChinaSpecial: High frequency pcb
    Layer:4Thickness:0.79mm
    Surface: ENIGHole:0.2

    Specification:

    High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

    High frequency materials are UL 94V-0 rated for active devices and high power RF designs.


    Typical Applications

    • Cellular Base Station Antennas and Power Amplifiers
    • Microwave point to point (P2P) links
    • Automotive Radar and Sensors
    • low dielectric loss
    • RF Identification (RFID) Tags
    • The stability of the dielectric constant
    • An extremely low water imbibition
    • LNB’s for Direct Broadcast Satellites

    The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

    Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

    Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Features


    • High Thermal Performance
     Tg: 180°C (DSC)
     Td: 340°C (TGA @ 5% wt loss)
     Low CTE for reliability
    • T260: 60 minutes
    • T288: 30 minutes
    • RoHS Compliant
    • UV Blocking and AOI Fluorescence
     High throughput and accuracy during PCB
    fabrication and assembly
    • Superior Processing
     Closest to conventional FR-4 processing
    • Core Material Standard Availability
     Thickness: 0.002″ (0.05 mm) to 0.125″
    (3.2 mm)
     Available in full size sheet or panel form
    • Prepreg Standard Availability
     Roll or panel form
     Tooling of prepreg panels available
    • Copper Foil Type Availability
     Standard HTE Grade 3
     RTF (Reverse Treat Foil)
    • Copper Weights
     ½, 1 and 2 oz (18, 35 and 70 μm) available
     Heavier copper available upon request
     Thinner copper foil available upon request
    • Glass Fabric Availability
     Standard E-glass
     Square weave glass fabric available
     Spread glass fabric available
    • Industry Approvals
     IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
     UL - File Number E41625 as PCL-FR-370HR
     Qualified to UL's MCIL Program


    Rogers material in stock:


    BrandModelThickness(mm)DK(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO40030.254 0.508,0.813,1.5243.38
    RO43500.254 0.508,0.762,1.5243.5
    RO58800.254.0.508.0.7622.2
    RO30030.127,0.508,0.762,1.5243
    RO30100.63510.2
    RO32060.635MM10.2
    R030350.508MM3.5
    RO60100.635MM, 1,27MM10.2

    Quality Rogers And FR4 Mixed 4 layer pcb Board With ENIG Finished Surface In 0.79mm for sale
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