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ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz from wholesalers
     
    Buy cheap ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz from wholesalers
    • Buy cheap ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz from wholesalers

    ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE BK698
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz

    ER = 2.2 copper printed circuit board 0.508 mm Thinckness 1 Oz


    Quick Detail :
    1. Type : Pcb
    2. Material : Rogers
    3. Layer : Multilayer
    4. Products Size :4*9cm
    5. Permittivity :2.2
    6. Surface finish :Immersion Silver
    Features:
    1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
    2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
    3. Multilayer pcb design ,the precision of the pcb improves much more better .
    4. Low dielectric : 2.5 dielectric conductivity much more precision .


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :


    RO4000® Laminates

    Industry leading RO4000® hydrocarbon ceramic laminates and prepregs offer superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.


    RO4000 material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. RO4000 series laminates offer a range of dielectric constants (2.55 - 6.15), are available with UL 94 V-0 flame retardant versions.


    High Thermal Performance

    • Tg of 200 (DSC), 230°C (DMA)

    • Low CTE for reliability

    • Lead-free Compatible & Rhos Complaint

    • UV Blocking and AOI Fluorescence

    • Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat



    PrePreg Material


    It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

    Key Benefits:


    • Optimized cost and RF / microwave performance
    • Compatible with FR-4 fabrication including multilayer PCB constructions
    • High thermal conductivity for improved thermal management over traditional PTFE materials
    • Robust lead-free solder processing compatibility
    • Low Z-axis CTE for reliable plated through-hole quality

    Typical Applications:

    • Cellular Base Station Antennas and Power Amplifiers
    • Microwave point to point (P2P) links
    • Automotive Radar and Sensors
    • RF Identification (RFID) Tags
    • LNB’s for Direct Broadcast Satellites

    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.

    Detailed Image


    Payment :


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