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Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass from wholesalers
     
    Buy cheap Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass from wholesalers
    • Buy cheap Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass from wholesalers
    • Buy cheap Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass from wholesalers

    Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE Bh71
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass

    Multilayer High Frequency PCB Induction Cooker PCB Sensor PCB Mass Production

    Quick Detail :
    1. Type : Pcb
    2. Material : Rogers
    3. Layer : Multilayer
    4. Products Size :11*8cm
    5. Permittivity : 2.5
    6. Surface finish : Immersion Gold

    Features:
    1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
    2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
    3. Multilayer pcb design ,the precision of the pcb improves much more better .
    4. Low dielectric : 2.5 dielectric conductivity much more precision .


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :

    RO3006™ and RO3010™ Laminates

    RO3006™ and RO3010™ laminates ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

    These laminates offer excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3006™ and RO3010™ exhibits a low dissipation factor of 0.0020 at 10 GhZ for RO3006 laminates and 0.0022 at 10 GhZ for RO3010 laminates.

    A higher dielectric constant (6.15) when compared to RO3003.



    PrePreg Material
    It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.


    Benefits:

    • Lowest loss commercial laminates (RO3003)
    • Are available in a wide range of Dk (dielectric constant) (3.0 to 10.2)
    • Are available both with and without woven glass reinforcements
    • Low Z-axis CTE (24 ppm/C) provides plated through hole reliablity
    • Low TCDk for electrical stablity versus temperature (RO3003)

    Typical Applications:

    • Automotive radar applications
    • Global positioning satellite antennas
    • Cellular telecommunications systems - power amplifiers and antennas
    • Patch antenna for wireless communications
    • Direct broadcast satellites
    • RFID Tags
    • Surface mount RF components
    • E-Band point to point microwave links

    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.



    Quality Multilayer High Frequency PCB Induction Cooker PCB Sensor Mass for sale
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