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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service from wholesalers
     
    Buy cheap Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service from wholesalers
    • Buy cheap Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service from wholesalers

    Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCER
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

    Rigid PCB Circuit Board Fabrication Prototype Service With Vias Plug Filled


    Origin:ChinaSpecial: vias filled and capped
    Layer:4Thickness:1.524mm
    Surface: HaslHole:0.8

    Specification:


    • Polyimidemprodesu-highennalperfonnanwith
    Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
    • Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
    • Maini mechani 1 strength and bonding sngth at high temperature.
    • Tough resin systemNon-MOAemist
    • Haelfrree chemistry mpatible withe1 pro sslng.
    RoHSJWEEE mpliant.
    • IPC4101D.0/41


    Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

    High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Features


    • Polyimidemprodesu-highennalperfonnanwith
    Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
    • Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
    • Maini mechani 1 strength and bonding sngth at high temperature.
    • Tough resin systemNon-MOAemist
    • Haelfrree chemistry mpatible withe1 pro sslng.
    RoHSJWEEE mpliant.
    • IPC4101D.0/41


    • CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
    • ER = 3.38/3.48 at 10.0 GHz
    • ER is constant to 40.0 GHz
    • ED (electro-deposited) copper only
    • Layer-to-layer thickness control = +/- 0.001
    • Fabrication costs are typical to slightly increased


    Quality Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service for sale
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