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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects from wholesalers
     
    Buy cheap Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects from wholesalers
    • Buy cheap Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects from wholesalers
    • Buy cheap Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects from wholesalers

    Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE
    Certification : CE/ROHS/SGS/MSDS/UL
    Price : negotiation
    Supply Ability : 1000000pcs/month
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    • Company Profile

    Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

    XCE specialize in manufacturing various hi-frequency PCB and multilayer board including fastest sample products. Provides you with a unique one stop solution to all your printed circuit needs, including PCB manufacturing and assembly.


    Radar microwave circuit board (PCB) production,Doppler sensor module LED light board,5.8G,24G sensor board, speed electronic dog motherboard,Rogeros high frequency board,Taconic high frequency board, TP-2 special media board,Board,F4B domestic high-frequency board,Rogeros and FR4 mixing plate,4G antenna high frequency board,4G base station high frequency board.


    Highlights:

    Rigid PCB–2 Layer to 48 Layers

    Blind/buried via

    Backplane

    High Density Interconnects (HDI)

    Board thickness 8mm

    Maximum copper thickness 8 oz


    PCB surface finish:

    HASL

    Leadfree HASL

    OSP

    ENIG Immersion Gold

    Immersion tin

    Flash gold


    Laminate Materials:

    FR4 Normal and high-TG

    Rogers

    Taconic

    Isola

    F4B


    Special requirements:

    Peelable solder mask

    Carbon ink

    Buried capacitor/resistor


    Quality Standard certifications:

    ISO9001

    QS9000

    ISO14001

    TS16949

    AS9100

    UL Underwriter Laboratories


    IPC-600 Class 2Standard manufacturing specifications
    IPC-600 Class 3Available as required
    IPC-6012Available as required with in-house testing capabilities

    Inner layer pads025″ / 0.635mm oversize minimum
    Smallest finished via.004″ / 0.102mm
    Standard pad size (.002″/ 0.051mm annular ring)0085″ / 0.216mm annular ring (.017″ / 0.432mm oversize)
    Smallest pad size (.001″ / 0.025mm annular ring).0075″ / 0.191mm annular ring (.015″ / 0.038mm oversize)
    Standard line and spacing.005″ / .005″ (0.127mm / 0.127mm)
    Special line and spacing.003″ / .003″ (0.076mm / 0.076mm)
    Quality Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects for sale
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