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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEP |
| Certification : | CE,ROHS, FCC,ISO9008 |
| Price : | negotiation |
HDI pcb, quick turn HDI pcb, blind microvia pcb&laser Microvia filling pcb mfg. Professional PCB FAB. No MOQ. One-stop PCBA. China PCB company. Services: Metal Core PCB Service, Rigid Flex PCB Service, Heavy copper PCB Service, Flexible Circuit Service etc.
HDI PCB Fr4 High Speed Multilayer Fabrication With Impedance Control
Specification
| PCB Type: | FR4 PCB |
| Layer : | 4 layer |
| Min .Line Width/Space: | 8milmil/8mil |
| Min. Via Diameter: | 0.3mm |
| Finish Thickness: | 20mil |
| Surface Finish: | ENIG |
| Size: | 3*6MM |
| Material: | KB FR4 |
| Color: | green |
| Application: | aviation |
High frequency PCB Introduce:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
Description:
FR4 Multi-Layer PCB refer to printed circuit board has more than
two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology
improving, people can put more and more copper layers on the same
board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for
different purpose, such as layers for power, for signal
transfering, for EMI shielding, for components assembly, and so on.
In order to avoid too many layers, Buried Via or Blind via will be
designed in multi-layer PCB. For board more than 8 layers, high Tg
FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will
be, and more expensive the cost will be. The lead time of
multi-layer PCB is different from normal one, please contact us for
accurate leading time.
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