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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XER |
| Model Number : | XCEH |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | $0.5-15 |
| Supply Ability : | 1, 000, 000 PCS / week |
16 Layer TG170 High TG PCB Printed Circuit Board Professional
Producer
Specification:
Board size: 18*16 cm
Board thickness: 0.8mm
Copper foil: 35UM
Layer: 16
Parameter:
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
| Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” | ||
| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | ≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | |
| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
Description:
Tg is Glass Transition Temperature. As flammability of board is V-0
(UL 94-V0), so if the temperature exceeds designated
tg value, the board will changed from glassy state to rubbery state
and then the function of board will be affected.
High TG materials have better mechanical strength, dimension
stability, adhesiveness, moisture absorption, thermal
decomposition,
and thermal expansion than normal TG pcbs.
High Tg material (TG170) is also popular in LED lighitng industry,
because heat dissipation of LED is higher than normal electronic
components, however same structure of FR4 board is much cheaper
than that of metral core pcbs, like aluminum board.
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