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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEM |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
PCB Capability
| Xinchenger Electronics Co.,Ltd | ||
| Seq | Item | capability |
| 1 | Base Material | FR-4,Rogers ,Arlon,F4B,Taconic,Teflon etc |
| 2 | Layers | 1-40 ( ≥30 layers needs review ) |
| 3 | Finished inner/outer copper thickness | 0.5-6OZ |
| 4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
| Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% | ||
| 5 | Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
| 6 | Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
| 7 | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
| Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil | ||
| 8 | Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
| 9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
| 10 | Aspect Ratio | 15:01 |
| 11 | Min welding ring | 4mil |
| 12 | Min solder mask bridge | ≥0.08mm |
| 13 | Plugging vias capability | 0.2-0.8mm |
| 14 | Hole tolerance | PTH: +/-3mil NPTH: +/-2mil |
| 15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| 16 | Solder mask color | Green,yellow,black,blue,red,white,matte green |
| 17 | Component mark color | white,yellow,black |
| 18 | Surface treatment | OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ |
| 19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
| Min spacing from test pad to board edge : 0.5 mm | ||
| Min conductive resistance : 5 Ω | ||
| Max insulation resistance : 250 MΩ | ||
| Max test voltage : 500 V | ||
| Min test pad diameter : 6 mil | ||
| Min test pad to pad spacing : 10 mil | ||
| Max test current : 200 MA | ||
| 20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
| Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch | ||
| PCB Item | Manufacture Capacity |
| Layer Counts | 1--20L |
| Base Material | FR4,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Material Thickness(mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 |
| Max board size(mm) | 1200x400mm |
| Board Outline Tolerance | ±0.15mm |
| Board Thickness | 0.4mm--3.2mm |
| Thickness Tolerance | ±8% |
| Minimum line/space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min Hole Size(mechanical) | 0.2mm |
| Min Hole Size(laser hole) | 0.1mm |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL/LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| Surface Finish | HAL,ENIG,Plated Gold,Immersion Gold,OSP |
| Copper | |
| Copper Weight | 0.5--6oz |
| Color | |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silk screen | White, Black, Blue,Yellow |
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
| Certificate | ROSH,ISO9001,UL |
LEAD TIME FOR PRODUCTION ORDERS:
| Sample Lead time | Mass production lead time | |
| Single sided PCB | 1~3 | 4~7 |
| Double sided PCB | 2~5 | 7~10 |
| Multilayer PCB | 7~8 | 10~15 |
| PCB and Assembly | 8~15 | 15~20 |
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