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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEM |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
This is a type of RO4350B PCB for the application of Splitter. It's a 2 layer board at 0.9mm thick.
The base laminate is from Rogers Corp.. Solder mask and silkscreen from Taiyo. It's fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Welcome to ShenZhen Xinchenger Electronics Co.,Ltd
ShenZhen Xinchenger Electronics Co.,Ltd is an professional PCB Board Manufacturer since 2000, owns 3 modern Printed Circuit Board factories in Guangdong, China. With over 18 years experience, we offer OEM & ODM PCB Layout, PCB Design, PCB manufacturing, PCB Assembly and PCB Copy in single-sided PCB Board, double-sided PCB and Multilayer Printed Circuit Board service to our customers, with total production capacity of 290,000 sqm/month.
Our One-Stop Service for PCB & PCB Assembly manufacturing:
1. Quick Quotation - Competitive factory direct price is always offered
2. Free Sample - Sample for free before mass production
3. Quality Control - Complete test procedure is necessary
4. On Time Delivery - Customize the logistics plan according to customer's requirement
5. After-sale Service - Reply to the claim within 24 hours to make sure our customer's manufacturing
Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil Finished thickness | ||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
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