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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board from wholesalers
     
    Buy cheap 6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board from wholesalers
    • Buy cheap 6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board from wholesalers

    6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board

    6-Layer HDI Multilayer PCB, Immersion Gold Surface Finishes Board

    Description:

    We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
    F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
    FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.

    Features:
    >Glass-reinforced hydrocarbon and ceramic dielectric
    >Excellent high frequency performance due to low dielectric tolerance and loss
    >Stable electrical properties versus frequency
    >Low Z-axis expansion and excellent dimensional stability

    specification:
    layer: multilayer
    material: fr4
    Tg value: tg135-tg180
    board thickness:1.6mm
    copper thickness:.1.5oz
    surface treatment:Hasl lead free+gold finger
    About us:
    With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
    Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

    PCB Manufacturing Capabilities

    Smallest drill size of 0.1mm (~4mil)

    1 to 36 layers

    FR4, Rogers, Taconic,Arlon,F4B

    PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.

    0.4 ounce to 4 ounce copper

    Minimum Trace / Space of 3mil.

    Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.

    Board finish colors; Green, Blue, Black, Yellow, Red, White.

    Parameter:

    Product nameFR4 PCBDouble side4 layer6 layer8 layer10-28layer
    layerSingle sideDouble side4 layer6 layer8 layer10-28layer
    Base MaerialFR4FR4,Alu,polymideFR4FR4FR4FR4
    Copper thickness1-6OZ
    Min.Hole size0.1mm
    Min.Line Width0.1mm
    Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    Solder masker colorgreen,red,black,white,yellow
    Silkscreen colorblack,white,yellow
    Tolerance- Shape tolerance: ±0.13
    - Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    Special requirementsBuried and blind vias+controlled impedance +BGA

    Rigid PCB Manufacturing Capabilities
    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:01
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:01

    Layers1-16 layersMin Board Thickness(2-layer)0.2mm
    Max Board Size635 × 1100mmMin Board Thickness(4-layer)0.6mm
    Min Board Size20 × 30mmMin Inner-layer Thickness0.1mm
    Min Trace0.1mmMin Annular Ring0.1mm
    Min Space0.1mmMin Hole Location Tolerance±0.075mm
    Min Hole Size0.2mmMin Hole Size Tolerance±0.05mm
    Board Warp≤ 1°Min Outer Dimension Tolerance±0.1mm
    Solder MaskGreen, Yellow, Red, Black, Blue, White
    Surface FinishHAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
    Board MaterialFR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
    Acceptable fileGerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
    CAM softwareGenesis, CAM350


    Quality 6 Layer HDI Multilayer FR4 PCB Immersion Gold Surface Finishes Board for sale
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