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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask from wholesalers
     
    Buy cheap RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask from wholesalers
    • Buy cheap RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask from wholesalers

    RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE Bh788
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask


    RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask


    Quick Detail :
    1. Type : Pcb
    2. Material : FR4
    3. Layer : Multilayer
    4. Products Size: 7*6cm
    5. Permittivity : 2.5
    6. Surface finish : Immersion Tin


    Description :

    1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

    2. Material Type: FR4,Cooper Base,high frequency material,Rogers,Taconic,Isola,F4B,Arlon

    3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

    4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

    Data :

    Layer1 to 28 layers
    Material typeFR-4,Rogers,Taconic,Isola,F4B
    Board thickness0.21mm to 7.0mm
    Copper thickness0.5 OZ to 7.0 OZ
    Copper thickness in hole>25.0 um (>1mil)

    Size

    Max. Board Size: 23 × 25 (580mm×900mm)
    Min. Drilled Hole Size: 3mil (0.075mm)
    Min. Line Width: 3mil (0.075mm)
    Min. Line Spacing: 3mil (0.075mm)

    Surface finishing

    HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

    Tolerance


    Shape tolerance: ±0.13
    Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    CertificateUL, ISO 9001, ISO 14001
    Special requirementsBuried and blind vias+controlled impedance +BGA
    ProfilingPunching, Routing, V-CUT, Beveling

    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s


    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:01
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:1c


    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.

    Product Tags:

    custom-made pcb

      

    custom pcb

      
    Quality RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask for sale
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