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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics from wholesalers
     
    Buy cheap 4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics from wholesalers
    • Buy cheap 4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics from wholesalers

    4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics

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    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics

    4 Layer Panel FR4 PCB Inverter PCB Design
    specification:
    layer: multilayer
    material: fr4
    Tg value: tg135-tg180
    board thickness:1.6mm
    copper thickness:.1.5oz
    surface treatment:Hasl lead free+gold finger
    About us:
    With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
    Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )


    XCE PCB technical specification
    Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
    Layer No. 1-16
    Min board thickness 2 layer 0.2mm
    4 layer 0.4mm
    6 layer 0.6mm
    8 layer 0.8mm
    10 layer 1.0mm
    Max panel size 508*610mm
    Board thickness tolerance T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness >0.025mm(1mil)
    Finished hole 0.2mm-6.3mm
    Min line width 4mil/4mil(0.1/0.1mm)
    Min bonding pad space 0.1mm(4mil)
    PTH aperture tolerance ±0.075mm(3mil)
    NPTH aperture tolerance ±0.05mm(2mil)
    Hole site deviation ±0.05mm(2mil)
    Profile tolerance ±0.10mm(4mil)
    Board bend&warp ≤0.7%
    Insulation resistance >1012Ωnormal
    Through-hole resistance <300Ωnormal
    Electric strength >1.3kv/mm
    Current breakdown 10A
    Peel strength 1.4N/mm
    Soldmask regidity >6H
    Thermal stress 288℃20Sec
    Testing voltage 50-300v
    Min buried blind via 0.2mm(8mil)
    Outer cooper thickness 1oz-5oz
    Inner cooper thickness 1/2 oz-4oz
    Aspect ratio 8:1
    SMT min green oil width 0.08mm
    Min green oil open window 0.05mm
    Insulation layer thickness 0.075mm-5mm
    Aperture 0.2mm-0.6mm
    Special technology Inpedance,blind buried via,thick gold,aluminumPCB
    Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


    Parameter:

    Product nameFR4 PCBDouble side4 layer6 layer8 layer10-28layer
    layerSingle sideDouble side4 layer6 layer8 layer10-28layer
    Base MaerialFR4FR4,Alu,polymideFR4FR4FR4FR4
    Copper thickness1-6OZ
    Min.Hole size0.1mm
    Min.Line Width0.1mm
    Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    Solder masker colorgreen,red,black,white,yellow
    Silkscreen colorblack,white,yellow
    Tolerance- Shape tolerance: ±0.13
    - Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    Special requirementsBuried and blind vias+controlled impedance +BGA

    Rigid PCB Manufacturing Capabilities
    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:01
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:01

    Layers1-16 layersMin Board Thickness(2-layer)0.2mm
    Max Board Size635 × 1100mmMin Board Thickness(4-layer)0.6mm
    Min Board Size20 × 30mmMin Inner-layer Thickness0.1mm
    Min Trace0.1mmMin Annular Ring0.1mm
    Min Space0.1mmMin Hole Location Tolerance±0.075mm
    Min Hole Size0.2mmMin Hole Size Tolerance±0.05mm
    Board Warp≤ 1°Min Outer Dimension Tolerance±0.1mm
    Solder MaskGreen, Yellow, Red, Black, Blue, White
    Surface FinishHAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
    Board MaterialFR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
    Acceptable fileGerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
    CAM softwareGenesis, CAM350



    Quality 4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics for sale
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