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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEM |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
2.00mm 8 layers Gold Immersion FR4 High TG PCB
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including
lamination.imersion Gold),we make 1~24layers board in guaranteed
quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness
0.2~7.0mm,copper thickness 1/3~8oz are available )
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |||||
| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Layers | 1-16 layers | Min Board Thickness(2-layer) | 0.2mm |
| Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
| Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
| Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
| Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
| Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
| Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
| Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
| Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
| Board Material | FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic | ||
| Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
| CAM software | Genesis, CAM350 | ||
Rigid PCB Manufacturing Capabilities
| Total Pad Size | Standard | Advanced |
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
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