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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board from wholesalers
     
    Buy cheap Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board from wholesalers
    • Buy cheap Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board from wholesalers

    Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

    Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board


    Specification:

    High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

    High frequency materials are UL 94V-0 rated for active devices and high power RF designs.




    Advantage

    Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board
    1.Sufficient high frequency material raw
    2. PCB Have the comprehensive quality control system
    3. PCB good price
    4. PCB quick turn delivery time from 48hours.
    5. PCB certification(ISO/UL E354810/RoHS)
    6. 12 years experience in exporting service
    7. PCB is no MOQ/MOV.
    8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting



    Reference - our production capability for rigid PCB:
    Layers: 1 to 28
    Board finished thickness: 0.2 to 7.0mm
    Materials: FR4,Rogers,Taconic
    Max. finished board size: 23 x 25 (580 x 900mm)
    Min. drilled hole size: 3mil (0.075mm)
    Min. line width: 3mil (0.075mm)
    Min. line spacing: 3mil (0.075mm)
    Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
    Immersion Silver/gold,OSP, gold plating
    Copper thickness: 0.5-7.0oZ
    Solder mask color: green/yellow/black/white/red/blue
    Copper thickness in hole: >25.0μm (>1mil)
    Inner packing: Vacuum packing/plastic bag
    Outer packing: Standard carton packing
    Shape tolerance: ±0.13
    Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
    Special requirements: buried and blind Vias + controlled impedance + BGA
    Profiling: Punching, routing, V-CUT, beveling
    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products



    High Thermal Performance
    Tg of 200 (DSC), 230°C (DMA)
    Low CTE for reliability
    Lead-free Compatible & Rhos Complaint
    UV Blocking and AOI Fluorescence
    Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat


    PrePreg Material
    It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

    Parameter:

    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Main Export Markets:
    Eastern Europe
    North America
    Mid East/Africa
    Western Europe
    Asia
    Central/South America

    Primary Competitive Advantages:
    Experienced Staff
    Green Product
    Packaging
    Price
    Prompt Delivery
    Quality Approvals
    Small Orders Accepted


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