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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask from wholesalers
     
    Buy cheap 60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask from wholesalers
    • Buy cheap 60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask from wholesalers

    60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask

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    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask

    60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure


    Key Specifications/Special Features:
    PCB features:
    Layer: 2
    Material: Rogers
    Thickness: 1.524mm
    Copper: 1oz
    Mini hole: 0.2mm
    Mini width/space: 0.2mm/0.2mm
    Finish: immersion Gold


    Specifiction:
    layer:2
    board thickness:1.524mm
    Copper thickness:1oz
    min Hole size:0.2mm
    min line width and distance:10/10mil
    Surface treatment: imersion gold
    Application: 60GHz Development System

    Product Description
    L1-L2 Blind holes;
    L2-L3 Bury holes;
    L1-L4 Through holes;
    Copper based with Rogers 4003 T1.3mm.
    Copper thickness 0.70mm;
    Milling thickness 1.2mm.


    Specification

    PCB Type:Rogers PCB
    Layer :2 layer
    Min .Line Width/Space:3mil/3mil
    Min. Via Diameter:0.3mm
    Finish Thickness:0.2mm
    Surface Finish:ENIG
    Size:65*165MM
    Material:Rogers
    Color:White
    Application:aviation

    60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

    Available substrates:
    RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE
    4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)
    10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)
    13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)
    20mil (0.508mm) 32mil(0.813mm)
    30mil(0.762mm) 60mil(1.524mm)
    60mil(1.524mm)


    Specification:

    High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

    High frequency materials are UL 94V-0 rated for active devices and high power RF designs.


    Why us:
    1 Iso 9001,14001,TS16949,UL Certified.
    2 900+staff,registered capital USD1.68million.
    3 Full-process workshop-lamination workshop,imersion gold workshop,AOI test

    4 Mental base PCB,high frequency pcb(rogers,ITEQ,tyflon,Taconic),Buried/blind via board,1~20layers board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available here.
    6 All exported PCB have double-check before sending out.

    UL (E246887), ISO9001, TS16949, ISO 14001 certified.

    Turnover USD 50-100 million per year

    25,000 sqm area,900+ staff

    Mass Production from single to 20 layers

    Special Material: ROGERS, Arlon, Taconic.etc.

    Client: SAMSUNG, Skyworth, Malata, Midea.etc.


    Description :
    RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
    RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.




    Quality 60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask for sale
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